IOTA 69445 Thermal‑Conductive Adhesive, 2.5W/m·K High Thermal Conductivity for Integrated Bonding & Heat

IOTA 69445 addition‑cure one‑component thermal‑conductive adhesive achieves thermal conductivity of 2.5 W/m·K with reliable adhesion and flexibility. Low‑BLT design and low thermal‑resistance change r......

2026-08-25

IOTA 69445 One‑Component Thermal Conductive Adhesive, Compatible With Stencil Printing & Dispensing for High‑Efficiency Electronics Production

IOTA 69445 is addition‑cure one‑component thermal‑conductive adhesive in grey micro‑fluid form. It supports stencil printing and dispensing with low BLT for precise bond‑line‑thickness control. Therma......

2026-08-24

IOTA 69550 Thermal‑Conductive Adhesive, Integrated Thermal Dissipation & Bonding for Electronic Components

IOTA 69550 addition‑cure one‑component thermal‑conductive adhesive delivers 2.2 W/m·K thermal conductivity with strong adhesion and good flexibility. Low‑BLT property and low thermal‑resistance change......

2026-08-24

IOTA 69550 One‑Component Thermal Conductive Adhesive, Compatible With Stencil Printing & Dispensing for Efficient Electronics Manufacturing

IOTA 69550 is addition‑cure one‑component thermal conductive adhesive in semi‑thixotropic fluid form. It supports stencil printing and dispensing with low BLT for precise bond‑line thickness control. ......

2026-08-21

IOTA 61102 Pure Methyl Silicone Resin, For Laminates Bonding & Stone Abrasion‑Resistant Polishing

IOTA 61102 silicone resin for mica bonding has viscosity 14‑40s (Ford‑4 cup) and 50% solid content. Besides bonding high‑temperature mica boards and glass‑fiber laminates, it also works as wear‑resist......

2026-08-20

IOTA 61102 Silicone Resin for Mica Bonding, High‑Temp Insulating Binder for Mica Board Production

IOTA 61102 is pure methyl silicone resin, colorless or light‑yellow transparent liquid free of mechanical impurities with 50% solid content. It features excellent heat resistance, electrical insulatio......

2026-08-19

IOTA 3922A Special Silicone Resin, Fast‑Drying & High Tack for Industrial Mica‑Tape Coating

IOTA 3922A is fast‑drying binder for mass production of fire‑resistant mica tapes and PSA tapes. Dilute with toluene or xylene to 18‑20% concentration, add 1.0‑3.0% BPO / DPP curing agent. Dissolve cu......

2026-08-19

IOTA 3922A Silicone Resin for Mica Tape, High Heat & Insulation Performance for Fire‑Resistant Mica Tapes

IOTA 3922A is colorless or light‑yellow homogeneous liquid free of mechanical impurities, solid content 60±2%, viscosity ≥30000cp. It delivers outstanding heat resistance, flexibility, insulation and ......

2026-08-18

IOTA H1400 One‑Component Siloxane Sealant, Low Viscosity for Easy Application & Long‑Lasting High‑Temp Sealing

IOTA H1400 is one‑component silicone‑resin sealant. The colorless transparent low‑viscosity liquid (~300cp) features good fluidity for gap wet‑out and coating. Fully cured at 300℃ for 2 hours, the cur......

2026-08-17

IOTA H1400 Siloxane Sealant, Resist Thermal Shock & Aging for High‑Temperature Sealing of Engine Blades and Hubs

IOTA H1400 is solvent‑containing one‑component silicone‑resin sealant, colorless transparent liquid with viscosity around 300cp, long‑term temperature resistance over 325℃. Test results show no cracki......

2026-08-17

IOTA H21000 Polysilazane Adhesive, Max 1100℃ Heat Resistance, Stable Bond Strength Over Wide Temperature Range

IOTA H21000 is solvent-free two-component grey-black polysilazane adhesive with viscosity 1000~3000cp, fast medium-temperature curing and continuous service temperature of 1000-1100℃. It delivers stab......

2026-08-14

IOTA H21400 Two-Component Borosilazane Adhesive, Universal Sealing & Raw Material for High-Temp Protective Coatings

This solvent-free grey two-component adhesive cures fast at medium temperature and withstands 1300-1500℃, serving two major industrial applications. It bonds and seals metal, ceramic and composite com......

2026-08-13

IOTA H21400 Borosilazane Adhesive, Special for Graphite, Stable Bond Strength Up To 1000℃

IOTA H21400 is solvent-free two-component grey borosilazane adhesive with viscosity 3000~4000cp, continuous service temperature 1300-1500℃ and fast medium-temperature curing. It performs excellently o......

2026-08-12

IOTA H21600 Two-Part Polycarbosilane Adhesive, Universal Bonding & Raw Material for High-Temp Coatings

This grey solvent-free two-component polycarbosilane adhesive features flexible mixing ratio, fast medium-temperature curing and excellent heat resistance. It bonds and seals metal, ceramic and compos......

2026-08-11

IOTA H21600 Polycarbosilane Adhesive, Special for Quartz Bonding, Stable Strength After 1000℃ Aging

IOTA H21600 is solvent-free two-component adhesive with mixing ratio A resin : B filler = 1:1.5~2, grey paste with viscosity 3000~4000cp and fast medium-temperature curing. It delivers outstanding per......

2026-08-11