IOTA 69550 addition‑cure one‑component thermal‑conductive adhesive delivers 2.2 W/m·K thermal conductivity with strong adhesion and good flexibility. Low‑BLT property and low thermal‑resistance change rate guarantee stable long‑term thermal performance. It cures within 30 min at 150 ℃ with 3.2 MPa Al‑Al shear strength. The flexible cured layer absorbs mechanical stress. It serves multiple purposes: automotive‑electronic housing bonding, thermal fixation of heat‑generating devices such as MOSFETs, heating‑element attachment, wafer bonding and housing sealing. The semi‑thixotropic fluid works for both dispensing and stencil printing, meeting combined thermal‑conductive, bonding and sealing requirements for automotive electronics, power devices and semiconductor parts.