IOTA 69102 addition‑cure one‑component thermal‑conductive adhesive achieves thermal conductivity of 0.6 W/m·K. Cured Shore‑A hardness is merely 32±5. Its highly flexible matrix relieves thermal‑expans......
2026-09-08IOTA 69102 is addition‑cure one‑component thermal‑conductive adhesive in fluid form with density of 1.40 g/cm³. Compatible with stencil printing and dispensing, it features low BLT for precise thin‑bo......
2026-09-08IOTA 69316 condensation‑cure one‑component thermal‑conductive adhesive reaches thermal conductivity of 0.82 W/m·K. This white semi‑fluid cures by moisture. Cured Shore‑A hardness is 50±5. Its soft‑ela......
2026-09-07IOTA 69316 is condensation‑cure one‑component neutral alcohol‑release silicone thermal‑conductive adhesive. White semi‑fluid with titanium‑catalyzed formic‑acid‑removal system, it cures via ambient mo......
2026-09-07IOTA 69317 condensation‑cure one‑component thermal‑conductive adhesive delivers thermal conductivity of 1.5 W/m·K. This white paste cures via moisture. Cured Shore‑A hardness is 65±5. Its elastic matr......
2026-09-04IOTA 69317 is condensation‑cure one‑component neutral alcohol‑release silicone thermal‑conductive adhesive. White paste with titanium‑catalyzed formic‑acid‑removal system, it cures by ambient moisture......
2026-09-03Silicone, especially platinum‑catalyzed addition‑cure silicone, has low surface energy. It is prone to debonding and interfacial delamination when bonded to substrates such as metals, engineering plas......
2026-09-02Addition‑cure liquid silicone has inherently low molecular polarity. It lacks natural wettability and chemical‑bonding capacity towards PC, glass‑fiber‑reinforced PA, ABS, TPU, solid silicone and cert......
2026-09-01Adhesion Solution of IOTA-T9152 for Addition-Cure Silicone ｜IOTA IOTA-T9152 is a multi-functional special silane adhesion promoter compatible with addition-cure silicone, co......
2026-09-01IOTA 69320 condensation‑cure one‑component thermal‑conductive adhesive delivers high thermal conductivity of 2.03 W/m·K. This white paste cures via moisture. Cured hardness is 75±5 with firm bonding t......
2026-08-31IOTA 69320 is condensation‑cure one‑component neutral alcohol‑release silicone thermal‑conductive adhesive. White paste with titanium‑catalyzed formic‑acid‑removal system, it cures by ambient‑air mois......
2026-08-31IOTA 69322 is a condensation‑cure two‑component neutral alcohol‑releasing silicone thermal‑conductive adhesive. It comes as a white paste with a simple 1:1 mixing ratio. No complicated compounding is ......
2026-08-28IOTA 69337 condensation‑cure one‑component thermal‑conductive adhesive delivers 0.81 W/m·K thermal conductivity and V‑0 flame retardancy, integrating thermal conduction, gap filling and sealing functi......
2026-08-27IOTA 69337 condensation‑cure one‑component thermal‑conductive adhesive delivers 0.81 W/m·K thermal conductivity and V‑0 flame retardancy, integrating thermal conduction, gap filling and sealing functi......
2026-08-26IOTA 69337 is condensation‑cure one‑component neutral alcohol‑release thermal‑conductive silicone adhesive. White paste with density 1.65 g/cm³, titanium‑catalyzed formic‑acid‑removal system, cures by......
2026-08-25
