With continuous service temperature of 300–400℃, it delivers reliable bonding across wide temperature range: tensile shear strength over 8MPa at room temperature; strength remains above 8MPa after 1 h......
2026-08-10IOTA RH3400C is solvent-free three-component silicone modified cyanate ester adhesive with viscosity around 3500cp and 40 minutes working time for easy operation. Two optional curing processes: f......
2026-08-10In silicone rubber and flame‑retardant composite formulas, poor compatibility between inorganic fillers and organic matrices often causes compounding difficulties. IOTA‑26194 filler surface treatment ......
2026-08-07IOTA‑26194 filler surface treatment agent is developed for the surface modification of inorganic powders. It is applicable to surface treatment of fillers such as fumed silica, aluminum hydroxi......
2026-08-06Developed for thermal management of high-power components and wafers, IOTA 69550 reaches thermal conductivity of 2.2 W/m·K with low thermal resistance variation. It continuously dissipates chip heat t......
2026-08-05Developed for thermal management of high-power components and wafers, IOTA 69550 reaches thermal conductivity of 2.2 W/m·K with low thermal resistance variation. It continuously dissipates chip heat t......
2026-08-04Cured hardness is only Shore A 32±5 with superior flexibility, which relieves internal stress from thermal cycling and prevents cracking of wafers and tiny heating devices. It integrates bonding, ther......
2026-08-04Perfect for automatic screen printing and high-speed dispensing lines with low BLT for uniform thin bond lines in mass production. It fully cures within 30 minutes at 150℃ to boost production efficien......
2026-08-03No oven heating required; IOTA R2400 cures naturally at ambient temperature, perfect for factory assembly and equipment overhaul. The red two-part paste fits gaps of metal, ceramic and composite panel......
2026-08-03IOTA R2400 solvent-free red two-component adhesive is ideal for bonding and sealing metal, ceramic and carbon composite high-temperature parts. It delivers tensile shear strength over 1MPa at room tem......
2026-07-31Developed for thermal fixation of semiconductors and power components, IOTA 69550 integrates thermal conduction, adhesion and sealing in one product. Its 2.2 W/m·K thermal conductivity and thin bond l......
2026-07-30IOTA 69550 semi-thixotropic paste supports automatic screen printing and high-speed dispensing, featuring low BLT for uniform bond line thickness in mass manufacturing. It fully cures within 30 mins a......
2026-07-29IOTA R31800F fills gaps for metal, ceramic and carbon composite parts. Solid content over 50% with moderate viscosity for irregular crevices. Elastic after curing to absorb thermal deformation and pre......
2026-07-28Designed for gap sealing of metal, ceramic and composite equipment, IOTA R31800F withstands oxyacetylene flame up to 1800℃ for over 5 minutes without cracking. Cured three-component silicone poly......
2026-07-28IOTA H21400 withstands extreme temperature of 1300-1500℃, suitable for bonding and sealing all heat-resistant substrates. It joins high-temperature alloys, structural ceramics and carbon composite com......
2026-07-27
