IOTA 69550 is addition‑cure one‑component thermal conductive adhesive in semi‑thixotropic fluid form. It supports stencil printing and dispensing with low BLT for precise bond‑line thickness control. Thermal conductivity reaches 2.2 W/m·K, density 2.65 g/cm³, cures in 30 minutes at 150℃. After curing, Shore‑A hardness is 75±10, Al‑Al shear strength 3.2 MPa. It features good flexibility and low thermal‑resistance change rate. Suitable for bonding plastic housings to aluminum plates in automotive electronics, thermal fixing for MOSFETs, heating‑element lamination, wafer bonding and housing sealing. One‑component ready‑to‑use material fits automated assembly of electronic components.