IOTA H21600 is solvent-free two-component adhesive with mixing ratio A resin : B filler = 1:1.5~2, grey paste with viscosity 3000~4000cp and fast medium-temperature curing. It delivers outstanding performance for quartz bonding: bonding strength over 10MPa at room temperature, and still above 10MPa after 15 mins aging at 1000℃, preventing joint cracking under high heat.
Cure at 170~200℃ for efficient mass assembly of quartz parts. It also bonds & seals metal, ceramic and composite materials, and can be formulated into high-temperature resistant coatings. Custom 0.5L~10L plastic drums are available, 1-year shelf life under cool sealed storage, ideal for quartz and high-temperature ceramic production lines.