IOTA 69445 addition‑cure one‑component thermal‑conductive adhesive achieves thermal conductivity of 2.5 W/m·K with reliable adhesion and flexibility. Low‑BLT design and low thermal‑resistance change rate reduce interface thermal resistance and ensure stable heat dissipation for long‑term device operation. It cures in 30 min at 150 ℃ with 2.2 MPa Al‑Al shear strength. The flexible cured layer relieves stress caused by different thermal expansion coefficients of dissimilar substrates. It covers multiple applications: automotive‑electronic housing bonding, thermal fixation of heat‑generating components such as MOSFETs, heating‑element attachment, wafer bonding and housing sealing. The grey micro‑fluid is compatible with dispensing and stencil‑printing processes, meeting combined thermal‑conductive, bonding and sealing requirements for automotive electronics, power devices and semiconductor parts.