IOTA 69445 is addition‑cure one‑component thermal‑conductive adhesive in grey micro‑fluid form. It supports stencil printing and dispensing with low BLT for precise bond‑line‑thickness control. Thermal conductivity reaches 2.5 W/m·K, density 3.0 g/cm³, cures within 30 minutes at 150℃. After curing, Shore‑A hardness is 75±5, Al‑Al shear strength 2.2 MPa. Featuring good flexibility and low thermal‑resistance change rate, it delivers stable long‑term thermal performance. Ready‑to‑use one‑component material fits bonding between plastic housings and aluminum plates for automotive electronics, thermal fixing of MOSFETs, heating‑element lamination, wafer bonding and housing sealing for automated mass‑production of electronic components.