Perfect for automatic screen printing and high-speed dispensing lines with low BLT for uniform thin bond lines in mass production. It fully cures within 30 minutes at 150℃ to boost production efficiency. With thermal conductivity of 0.6 W/m·K and low thermal resistance variation, it delivers consistent heat dissipation during long-term vehicle operation.
It reaches 1.5 MPa shear strength on aluminum substrates, widely applied to automotive electronics: bonding plastic housings to aluminum plates, thermal fixation of MOSFETs, lamination of heating parts and equipment enclosure sealing. The fluid texture ensures smooth coating. As a one-component product, no manual mixing is required, ideal for standardized mass production of auto manufacturers and EMS factories.