Cured hardness is only Shore A 32±5 with superior flexibility, which relieves internal stress from thermal cycling and prevents cracking of wafers and tiny heating devices. It integrates bonding, thermal conduction and sealing for all kinds of precision electronic assembly. Suitable for wafer fixation, lamination of small heating elements, thermal bonding of low-power MOS tubes and industrial equipment housing sealing. Easy to apply via dispensing or screen printing. The cured layer features outstanding resilience and stable adhesion under long-term vibration and temperature fluctuation, serving as the ideal thermal fixing material for small & medium power precision electronics.