IOTA 69550 semi-thixotropic paste supports automatic screen printing and high-speed dispensing, featuring low BLT for uniform bond line thickness in mass manufacturing. It fully cures within 30 mins at 150℃ to boost production efficiency. With thermal conductivity of 2.2 W/m·K and low thermal resistance variation, it delivers consistent heat dissipation in long-term operation.
Ideal for automotive electronics: bonding plastic housings to aluminum plates, thermal fixation of MOSFETs and power heat sources, lamination of heating elements and enclosure sealing. It offers 3.2 MPa shear strength on aluminum substrates with Shore A hardness 75±10, flexible enough to resist cracking under thermal cycling.
One-component design eliminates mixing steps, perfectly suited for mass standardized production of auto manufacturers and EMS factories.