Developed for thermal fixation of semiconductors and power components, IOTA 69550 integrates thermal conduction, adhesion and sealing in one product. Its 2.2 W/m·K thermal conductivity and thin bond line reduce interfacial thermal resistance to rapidly dissipate chip heat and prevent overheating damage.
It firmly bonds wafers and heating components, and seals equipment housings & heat-generating parts with aluminum heat sinks, widely used in consumer electronics and power module fabrication.
Flexible cured layer absorbs thermal expansion stress with minimal performance degradation over time. Process-friendly for dispensing and screen printing with fast oven curing, serving as a reliable thermal bonding material for high-end power and semiconductor packaging.