IOTA 69102 addition‑cure one‑component thermal‑conductive adhesive achieves thermal conductivity of 0.6 W/m·K. Cured Shore‑A hardness is merely 32±5. Its highly flexible matrix relieves thermal‑expansion stress between dissimilar substrates and protects precision components. It offers reliable adhesion with 1.5 MPa Al‑Al shear strength and low thermal‑resistance change rate for consistent thermal performance over service life.
Complete curing takes 30 min at 150℃. The fluid material works well for both dispensing and stencil‑printing processes. It is widely used for automotive‑electronic housing bonding, thermal fixation of heat‑generating parts such as MOSFETs, heating‑element attachment, wafer bonding and housing sealing. Combining bonding, thermal conduction and stress‑buffering protection, it meets requirements of automotive electronics, power devices and semiconductor assemblies.