IOTA 69102 is addition‑cure one‑component thermal‑conductive adhesive in fluid form with density of 1.40 g/cm³. Compatible with stencil printing and dispensing, it features low BLT for precise thin‑bond‑line coating. It cures rapidly within 30 min at 150℃. After curing, Shore‑A hardness is 32±5, Al‑Al shear strength reaches 1.5 MPa. It delivers good flexibility and low thermal‑resistance change rate for stable long‑term heat dissipation. Thermal conductivity:0.6 W/m·K. Ready‑to‑use without mixing. Applications include bonding plastic housings to aluminum plates in automotive electronics, thermal fixing of MOSFETs, lamination of heating elements, wafer bonding and housing sealing. Ideal for mass‑production assembly of electronic components.