IOTA 69320 condensation‑cure one‑component thermal‑conductive adhesive delivers high thermal conductivity of 2.03 W/m·K. This white paste cures via moisture. Cured hardness is 75±5 with firm bonding to realize thermal conduction, adhesion and gap filling all‑in‑one. Titanium‑catalyzed neutral alcohol‑release system avoids corrosion on metals such as aluminum and copper. Applications: LED sealing, automotive‑component heat dissipation, PCB thermal positioning & sealing, gap filling between power transistors, thyristors, diodes and Al/Cu substrates. No mixing required with fast tack‑free performance. It balances thermal performance and processing convenience for lighting, automotive‑electronics and power‑device thermal‑sealing scenarios.