IOTA 69317 Thermal‑Conductive Adhesive, 1.5 W/m·K Thermal Conductivity, Elastic Compound for Diverse Power‑Component Applications
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IOTA 69317 condensation‑cure one‑component thermal‑conductive adhesive delivers thermal conductivity of 1.5 W/m·K. This white paste cures via moisture. Cured Shore‑A hardness is 65±5. Its elastic matrix relieves thermal‑stress between substrates while providing thermal conduction, bonding and gap‑filling functions.
Titanium‑catalyzed neutral alcohol‑release system prevents corrosion on metals like aluminum and copper. Typical uses: LED sealing protection, automotive‑component heat dissipation, PCB thermal positioning & sealing, gap filling between power transistors, thyristors, diodes and Al/Cu substrates.
No compounding required with fast skin‑forming performance. It balances thermal performance and processing convenience for lighting, automotive‑electronics and power‑component thermal‑sealing scenarios.