IOTA 69316 condensation‑cure one‑component thermal‑conductive adhesive reaches thermal conductivity of 0.82 W/m·K. This white semi‑fluid cures by moisture. Cured Shore‑A hardness is 50±5. Its soft‑elastic matrix absorbs thermal‑stress between dissimilar substrates while combining thermal conduction, bonding and gap‑filling functions.
Titanium‑catalyzed neutral alcohol‑release system prevents corrosion on metals such as aluminum and copper. Typical applications: LED sealing protection, automotive‑component heat dissipation, PCB thermal positioning & sealing, gap filling between power transistors, thyristors, diodes and Al/Cu substrates.
One‑component for simple handling with fast tack‑free performance. It balances gap‑filling capacity and processing convenience for thermal‑sealing in lighting, automotive‑electronics and power‑component sectors.