IOTA 69316 One‑Component Thermal‑Conductive Adhesive, 2‑4min Fast Tack‑Free, Semi‑Fluid for Easy Gap‑Filling

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IOTA 69316 is condensation‑cure one‑component neutral alcohol‑release silicone thermal‑conductive adhesive. White semi‑fluid with titanium‑catalyzed formic‑acid‑removal system, it cures via ambient moisture with no mixing or heating required. Density:1.65 g/cm³, tack‑free time only 2‑4 min to accelerate production‑line cycle. Shore‑A hardness 50±5 after curing, soft texture, thermal conductivity 0.82 W/m·K.
Good fluidity enables excellent wet‑out for micro gaps. Ready‑to‑use for automatic dispensing. Neutral formula is non‑corrosive to aluminum and copper. Suitable for LED lamp sealing, automotive‑electronic heat dissipation, PCB component positioning sealing, gap filling for power transistors, thyristors and diodes against metal substrates for mass‑production electronics assembly.

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