IOTA 69322 Two‑Component Thermal‑Conductive Adhesive|1:1 Easy Mixing Ratio, Ideal for Mass‑Production Thermal Gap‑Filling

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IOTA 69322 is a condensation‑cure two‑component neutral alcohol‑releasing silicone thermal‑conductive adhesive. It comes as a white paste with a simple 1:1 mixing ratio. No complicated compounding is required, greatly lowering production‑line operation barriers. With a density of 1.8±0.05 g/cm³ and a 30‑minute pot life, it supports automatic dispensing as well as manual application. It offers good processing tolerance and suits mass‑production operations.


After curing, it reaches Shore A hardness 70±5 with stable, deformation‑resistant structure and thermal conductivity of 0.9 W/m·K. It delivers reliable bonding performance and excellent thermal stability. The neutral alcohol‑releasing formulation is non‑corrosive to various electronic substrates, making it a cost‑effective choice for industrial thermal bonding and gap‑filling sealing applications.

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