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What are the advantages of silicone electronic potting adhesives compared with other potting adhesives? Advantage 1: It provides long - term protection for sensitive circuits or elect......
2025-02-12Silicone Potting Adhesive Most silicone electronic potting adhesives are soft and elastic after curing and can be repaired, simply referred to as soft glue, with relatively p......
2025-02-12I. What is Potting? Potting (gluing) refers to the process of filling polyurethane potting adhesive, silicone potting adhesive, or epoxy resin potting adhesive into devices containing ......
2025-02-12Mica, is a sheet of inorganic mineral material, which is characterised by insulation, high temperature resistance, glossy, stable physico-chemical properties, good thermal insulation, elasticity an......
2025-02-12Classification By Curing Method Peroxide - Initiated Free - Radical Cross - Linking Type: It has high adhesion and excellent high - temperature resistance, and cr......
2025-02-12Definition and Composition Definition: Organosilicon pressure - sensitive adhesive generally refers to the pressure - sensitive adhesive with organosilicon polymer as the main bod......
2025-02-12Performance Characteristics One - Component: One - component materials have relatively simple curing conditions, usually requiring external conditions such as moisture or heating ......
2025-02-11One - Component and Two - Component Organosilicon Thermally Conductive Adhesive Materials Packaging and Usage Methods One - Component: All components of one - component organo......
2025-02-11Performance Characteristics Addition - type: It features excellent heat resistance and weather resistance, capable of maintaining stable performance within a wide temperature rang......
2025-02-11In today's era of continuous development in materials science, organosilicon thermally conductive adhesive materials have been widely applied in numerous fields such as electronics, ......
2025-02-11The rise of the new energy industry has also brought huge market opportunities for organosilicon thermally conductive adhesive materials. In the field of new energy vehicles, the heat dissipation a......
2025-02-11Recently, with the growing demand for high-performance materials in various industries, the market prospects of organosilicon thermal conductive adhesive materials have become increasingly broad. ......
2025-02-11IOTA 69550 boasts numerous remarkable product features. In terms of process adaptability, it supports both stencil printing and dispensing. Whether it is for precise glue application in large -......
2025-02-105. Pressure During bonding, applying pressure to the bonding surface makes it easier for the adhesive to fill the pits on the adherend surface and even flow into deep holes and capilla......
2025-02-101. Surface Roughness When the adhesive can well wet the surface of the adherend (contact angle θ < 90°), surface roughening is beneficial for improving the wetting degree of the adh......
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