Medium-temperature Curing, High Efficiency & Quick Operation

The adhesive cures at medium temperature (only 170–200°C), significantly reducing energy consumption and equipment requirements compared to high-temperature curing adhesives. Its short curing time enables rapid progression to subsequent production processes, notably enhancing production efficiency.

Excellent High-temperature Resistance

As a ceramic precursor, polycarbosilane endows the adhesive with outstanding heat resistance and oxidation resistance. Even after aging at 1000°C for 15 minutes, the room-temperature shear strength remains >10 MPa—far exceeding ordinary adhesives—ensuring reliable performance in high-temperature environments for long-term stability of bonded parts.

Solvent-free Formula

The solvent-free composition meets environmental protection standards, minimizing environmental pollution. It also eliminates safety hazards caused by solvent volatilization, ensuring safer and more reassuring usage.