IOTA H21400 borosilazane adhesive redefines the new height of high-temperature resistance bonding with its excellent performance. It features medium-temperature rapid curing, requiring only heating to 170°C with the furnace for 2 hours of curing, which significantly improves production efficiency and saves time costs. It stands out particularly in high-temperature resistance, stably withstanding extreme high temperatures of 1300-1500°C. Even at 1500°C, the compressive shear strength remains above 2MPa, and it stably maintains over 8MPa in the range of 400°C-1000°C, with room-temperature bonding strength exceeding 5MP, demonstrating super-strong bonding stability and high-temperature adaptability.
The product is a solvent-free gray two-component system, with safe and environmentally friendly components. The contained borosilazane endows it with excellent chemical stability. It has a wide range of applications, perfectly achieving bonding and sealing between metals, ceramics, or composite materials, while also serving as an ideal choice for preparing high-performance high-temperature resistant coating materials, effectively meeting the needs of high-end fields such as aerospace and high-temperature industrial equipment.
Packaging is flexible, providing 0.5L-10L plastic drum packaging according to customer requirements. It is convenient to store, with a shelf life of up to 1 year when sealed and stored in a cool, dry place. Note that when using, ammonia gas may escape from the base adhesive after long-term storage, so it is recommended to operate in a ventilated environment to ensure safety. Whether facing harsh high-temperature working conditions or complex material bonding needs, IOTA H21400 borosilazane adhesive can provide reliable and efficient solutions.