Product characteristics:

1. Stencil printing/dispensing

2. Low BLT

3. Excellent bonding

4. Rapid curing and bonding @150℃, 30min

5. Low thermal resistance change rate

6. Flexibility

Technical index:

Thermal conductivity (W/m.k): 2.2

Status: semi-thixotropic fluid

Density (g/cm³): 2.65

Curing time: 150°C, 30min

Hardness (shoreA): 75±10

Shear strength (MPa, Al/Al): 3.2

Application:

1. Bonding of automotive electronic device plastic shells and aluminum plates;

2. Thermal conductive bonding and fixation of heating devices or MOS tubes;

3. Fitting of heating elements and fixed bonding of wafers;

4. Bonding and sealing of the casing, etc.