Product characteristics:

1.0.8W/m.K, one-component neutral dealcoholization

2. Moisture cured, paste appearance, V-0

3. Silicone thermally conductive adhesive

Technical index:

Appearance: white paste

Density (g/cm³): 1.65

Surface drying time (min): 10-20

Hardness (shore): 70±5

Thermal conductivity (W/m.k): 0.81

Deformic acid type, titanium catalyzed

Application:

1. Sealing of LED lamps

2. Heat dissipation of automotive electronic components

3. Heat dissipation positioning and sealing of PCB boards and electronic components

4. High power transistor

5. Filling the gap between the diode of the thyristor element and the base material (aluminum, copper)