1. 0.9W/m.K, two-component neutral dealcoholization

2. Paste appearance

3. Silicone thermally conductive adhesive

Technical index:

Mixing ratio: 1:1

Appearance: white paste

Density (g/cm³): 1.8±0.05

Operation time (min): 30

Hardness (shore A): 70±5

Thermal conductivity (W/m.k): 0.9

Application:

1.1:1 ratio, easy to mix, excellent bonding, good thermal stability and thermal conductivity

2. Areas that require heat dissipation such as automotive regulators and battery cell gap filling