Product characteristics:

1. 0.8W/m.K, one-component neutral dealcoholization

2. Moisture absorption solidification, semi-fluid

3. Organic silicon thermal adhesive bonding

Technical index:

External appearance: white semi-fluid

Density (g/cm³): 1.65

Table drying time (min): 2-4

Hardness (shore): 50±5

Heat rate (W/m.k): 0.82

Deformic acid type, titanium catalyzed

Application:

1. LED light fittings sealed

2. Steam train original equipment heating

3. PCB board and electronic equipment scattered heating position sealing

4. High power transistor

5. Gap filling between controlled silicone diode and base material (silver, copper)