Product characteristics:

1. Stencil printing/dispensing

2. Low BLT

3. Excellent bonding

4. Rapid curing and bonding @150℃, 30min

5. Low thermal resistance change rate

6. Flexibility

Technical index:

Thermal conductivity (W/m.k): 2.5

Status: Gray Microfluidics

Density (g/cm³): 3.0

Curing time: 150°C, 30min

Hardness (shore A): 75±5

Shear strength (MPa, Al/Al): 2.2

Application:

1. Bonding of automotive electronic device plastic shells and aluminum plates;

2. Thermal conductive bonding and fixation of heating devices or MOS tubes;

3. Fitting of heating elements and fixed bonding of wafers;

4. Bonding and sealing of the casing, etc.