The core components of the addition-cure one-component silicone thermal conductive adhesive are vinyl-containing polysiloxane and hydrogen-containing polysiloxane. Under the action of a catalyst, the vinyl group and the hydrogen group undergo a hydrosilylation reaction to achieve the curing of the adhesive. This unique curing reaction, compared with the condensation type, has the significant advantage of no small-molecule by-products, greatly improving the performance stability of the adhesive after curing. At the same time, the polysiloxane main chain structure endows the adhesive with good flexibility and chemical stability, ensuring excellent bonding performance even in complex environments.

Excellent Performance Leads the Development of the Industry

(I) Ultra-High Thermal Conductivity Ensures the Stable Operation of Equipment

In fields with extremely strict requirements for heat dissipation, such as electronics and energy, the addition-cure one-component silicone thermal conductive adhesive shows extraordinary thermal conductivity. Its thermal conductivity coefficient can be as high as 2.0 - 5.0W/(m·K), far exceeding that of similar condensation-type products and many traditional adhesives. The efficient heat conduction path can quickly transfer heat from the heat source, maintaining the equipment to work within a suitable temperature range, effectively avoiding performance degradation and failures caused by overheating, and greatly extending the service life of the equipment.

(II) Strong Bonding Strength Adapts to the Connection of Diverse Materials

Whether it is rigid materials such as metals and ceramics, or flexible materials such as plastics and rubbers, this adhesive can achieve high-strength and firm bonding. With the synergistic effect of chemical bonding formed by the hydrosilylation reaction and physical adsorption between molecules, a strong adhesion network is constructed on the surface of the adherend. Even in the face of severe temperature changes, mechanical vibrations, chemical corrosion and other harsh working conditions, the bonding joint remains as solid as a rock, providing a reliable guarantee for the structural integrity of the product.

(III) Excellent Weather Resistance and Chemical Stability Broaden the Application Boundaries

The inherent weather resistance of the silicone chemical structure enables the addition-cure one-component silicone thermal conductive adhesive to maintain stable performance when facing extreme environmental factors such as ultraviolet rays, ozone, high and low temperature cycles, and acid rain. After long-term outdoor exposure or chemical environment erosion, the adhesive will not experience aging phenomena such as yellowing, embrittlement, and degradation. It shows excellent applicability in fields such as outdoor facilities and chemical equipment, greatly broadening its application scope.

(IV) Fast Curing and Low Shrinkage Rate Improve Production Efficiency

The high efficiency of the addition reaction enables the adhesive to cure in a relatively short time, greatly shortening the production cycle and improving production efficiency. At the same time, the extremely low shrinkage rate during the curing process effectively avoids internal stress generated by volume changes, reducing the risk of damage to the adherend. It is especially suitable for the bonding of precision electronic components and optical devices with extremely high requirements for dimensional accuracy, ensuring high-precision assembly and stable performance of products.
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