IOTA 26194 macromolecular silane treating agent features trimethoxysiloxy groups for rapid hydrolysis. It reacts with silanol groups on thermal‑conductive‑filler surfaces and grafts polysiloxane segments onto powder particles to strengthen interfacial bonding between inorganic fillers and silicone matrix
Modified powders disperse uniformly inside silicone systems and reduce agglomeration. Higher filler‑loading capacity and lower interfacial thermal resistance can be achieved to upgrade overall performance of thermal‑conductive adhesives, thermal pads and other thermal‑interface materials. Low‑chloride impurity level meets strict reliability requirements of new‑energy and electronic heat‑dissipation materials. It solves incompatibility, sedimentation and caking issues between fillers and silicone resin and supports high‑performance thermal‑formula development.