IOTA 68210 addition‑cure two‑component thermal‑conductive adhesive delivers good thermal conductivity and low thermal resistance. Medium‑low hardness after curing enables cushioning against thermal‑cycling stress. It boasts high heat resistance and outstanding thermal stability, and bonds well to most substrates under room‑temperature conditions.
Simple 1:1 mixing ratio and low‑viscosity high‑flow characteristic allow full wetting of component gaps. It provides potting and dual bonding protection for automotive‑electronic modules, sensors, PV junction boxes, inverters, EV OBC units and lithium‑battery packs. Effectively dissipates operating heat and isolates environmental hazards to improve reliability of new‑energy electronics for automotive, photovoltaic and energy‑storage applications.