IOTA 68210 is addition‑cure two‑component thermal‑conductive adhesive. Viscosity:4000±500 mPa·s. Low‑viscosity and high‑flow property with 40‑80 min pot‑life. Simple 1:1 mixing ratio, compatible with automatic potting equipment. Density:1.60±0.05 g/cm³, fast‑curing, thermal conductivity 0.7 W/m·K with low thermal resistance.
After curing, Shore‑A hardness is 50±5, Al‑Al shear strength 0.6 MPa. It adheres to most substrates at room temperature and features good high‑temperature resistance and thermal stability. Suitable for potting and bonding of automotive‑electronic modules, sensors, photovoltaic junction boxes, inverters, EV OBC modules and lithium‑battery packs. High flow fills cavity gaps perfectly for mass production in new‑energy industries.