Cured IOTA 69102 addition thermal adhesive features ultra-low Shore A hardness of 32±5 with outstanding flexibility. It absorbs thermal expansion stress from metals, plastics and wafers to prevent component cracking and delamination, perfect for precision power device assembly. The fluid texture fills gaps completely, offering stable bonding strength and low thermal resistance for steady heat transfer. Short curing at 150°C avoids damage to heat-sensitive components, integrating bonding, thermal conduction and sealing functions. It specializes in thermal fixation of automotive MOSFETs, attachment of heating elements, wafer bonding and electric control housing sealing. Flexible and vibration-resistant, the adhesive stays intact under long-term thermal cycling, extending the service life of electronic modules. It is a low-stress thermal bonding solution tailored for new energy vehicles and industrial precision heat-generating components.