IOTA 69102 is a fluid one-component addition-cure thermal adhesive, compatible with stencil printing and automatic dispensing. Its low BLT feature forms uniform ultra-thin bond lines to cut interfacial thermal resistance, ideal for automated mass electronics manufacturing.
It has a density of 1.40 g/cm³ and thermal conductivity of 0.6 W/m·K, fully curing within 30 minutes at 150°C to shorten production cycles. Cured Al/Al shear strength reaches 1.5 MPa with reliable adhesion, plus low thermal resistance variation for consistent long-term heat dissipation. The one-component formula requires no mixing for easy operation. Widely used for bonding plastic housings and aluminum plates of automotive electronics, equipment housing sealing, and mass thermal fixation of MOSFETs, it delivers balanced production efficiency and thermal reliability for new energy ECUs and power semiconductors.