IOTA 68210 two-component addition thermal adhesive cures into flexible medium-hard elastomer, absorbing vibration and thermal expansion stress to prevent component cracking. The fluid fills gaps perfectly and cures at room or elevated temperature, flexible for lab sampling and mass production.
It features stable thermal conductivity and premium electrical insulation, resisting high-temperature aging without chalking or cracking over time. Customized for power battery modules, automotive controllers and high-power semiconductors, it fills cell gaps and bonds heat-generating parts to aluminum housings, efficiently dissipating heat to boost equipment stability and service life.