IOTA 68210 is a two-component addition-cure silicone thermal adhesive with standard 1:1 mixing ratio for simple blending. The white fluid boasts great fluidity and matches automatic dispensing & potting machines. It releases no small molecules and causes no corrosion to metal and plastic substrates. Fast heat curing greatly improves production efficiency. It delivers balanced steady thermal conductivity with low thermal resistance variation for consistent long-term heat dissipation. Cured elastomer buffers thermal cycling stress and maintains strong adhesion without delamination. Widely applied to new energy electric controls, PCB power boards, MOSFETs and heating elements for bonding & sealing, integrating thermal conduction, insulation and shock resistance for mass electronics manufacturing.