IOTA 69102 addition-cure silicone thermal adhesive features low flexible elasticity after curing (Shore A 32±5), which buffers thermal cycling stress to prevent component cracking and detachment. The fluid flows smoothly for excellent gap filling, paired with low thermal resistance to continuously dissipate heat from components.
It cures rapidly at 150°C for 30 mins with stable adhesion to plastics and metals. Customized for automotive electronics, it bonds electric control housings, fixes heat-generating MOSFETs, and attaches heating elements and chips for sealing. The flexible adhesive resists vibration and temperature fluctuations without cracking during long-term service, reliably protecting power components and extending the service life of automotive electronic systems.