IOTA 69320 condensation-type thermal adhesive features an eco-friendly neutral formula, causing no corrosion to metal substrates such as silver and copper, and compatible with various electronic components. The paste form is easy to apply. The moisture curing process fits conventional production lines with simple operation. It features moderate hardness, excellent sealing performance and adhesion for long-term stable service. With a thermal conductivity of 2.03 W/m·K, it efficiently dissipates operating heat and prevents component damage caused by high temperatures. Suitable for LED lighting, locomotive electrical appliances, circuit boards and power semiconductors. It integrates thermal conduction, bonding, sealing and gap filling, and effectively improves the operational stability and service life of electronic devices.