IOTA 69445 is a high-performance addition-cure silicone thermal adhesive. High-density filled formula realizes outstanding thermal conductivity up to 2.5 W/m·K; its gray micro-flow texture ensures smooth coating and excellent gap filling capacity.
Short-time thermal curing delivers flexible cured compound with superb shock resistance to cope with bumpy automotive working conditions. Low thermal resistance continuously drains heat from power components to avoid overheat failure.
Great adhesion to plastics, aluminum and copper substrates. It integrates bonding, thermal conduction and sealing for automotive electronic housing assembly, high-power MOS/heating element fixation, wafer bonding and full-unit enclosure sealing, effectively extending service life of electronic products.