IOTA 69445 is a one-component addition-cure thermally conductive adhesive in gray micro-flow formulation, compatible with stencil printing and automatic dispensing, while low BLT design enables ultra-thin bond line for superior heat dissipation. With thermal conductivity of 2.5 W/m·K and density of 3.0 g/cm³, it fully cures in 30 minutes at 150°C. After curing, Shore A hardness reaches 75±5 and Al/Al shear strength hits 2.2 MPa. Featuring flexible cured property and low thermal resistance variation rate, it delivers stable long-term heat dissipation performance. One-component formulation eliminates blending work. Widely applied for bonding plastic casings to aluminum panels of automotive electronics, thermal fixation of MOSFETs, wafer lamination and equipment housing sealing, an optimal thermal management material for new energy electronics mass production.