IOTA 69550 is an addition‑cure one‑component thermally conductive adhesive. It is a semi‑thixotropic fluid suitable for stencil printing and dispensing, with a low BLT design for stable heat dissipation in thin bond lines. Boasting a thermal conductivity of 2.2 W/m·K and density of 2.65 g/cm³, it cures rapidly at 150°C for 30 minutes to form a strong bond. Cured Shore A hardness: 75±10; Al/Al shear strength: 3.2 MPa. It features excellent flexibility, strong adhesion and a low thermal resistance change rate for long‑term thermal stability. Ideal for bonding plastic housings to aluminum panels in automotive electronics, securing MOSFETs, attaching heating elements, wafer bonding and housing sealing. One‑component, no mixing required, highly compatible with automated production lines.