IOTA H21400 is a high-performance solvent-free borosilazane adhesive designed for high-temperature structural bonding. It features medium-temperature short-time curing for efficient processing. With temperature resistance up to 1300–1500℃ and excellent strength across the full temperature range, it is especially suitable for graphite bonding and widely used for sealing and joining metals, ceramics and composite materials. It can also be formulated into high-temperature protective coatings. Stable performance, no failure or pulverization at high temperatures. Flexible customizable packaging, easy storage and 1-year shelf life. Ventilation is required during operation to avoid ammonia irritation. Combining ultra-high temperature resistance, high bonding strength and versatility, it meets the strict requirements of aerospace, industrial furnaces, high-temperature kilns and other harsh scenarios.