IOTA 68210 high-performance addition-cured thermally conductive adhesive stands out with low viscosity, high fluidity and low thermal resistance, enabling smooth application and excellent filling performance.With 1:1 mixing ratio and medium-low hardness, it provides strong adhesion to various substrates and stable performance at high temperatures. Thermal conductivity reaches 0.7 W/m·K for efficient heat dissipation.Generous working time makes it suitable for automated production lines. Widely used in automotive electronics, photovoltaics, energy storage and other fields. Stable performance combines bonding strength and heat dissipation efficiency, providing a reliable thermal conductive bonding solution for high-end electronic devices.