Are you still troubled by the heat dissipation and bonding of electronic components? IOTA 68210 addition-curing two-component thermal conductive adhesive provides a one-stop solution for you! This material features low viscosity and high fluidity, with flexible and controllable operating time. It has a thermal conductivity of 0.7 W/m·K and a low thermal resistance design, enabling efficient heat transfer. With fast curing speed and a shear strength of 0.6 MPa, it can form firm bonding with most substrates. Mixed at a 1:1 ratio, the product has moderate hardness after curing, excellent high temperature resistance and thermal stability. It is widely suitable for potting and bonding of automotive electronic modules, sensors, photovoltaic junction boxes, inverters, electric vehicle OBC modules, lithium battery packs, etc., helping various electronic devices operate stably.