As the requirements for bonding and thermal conductivity of electronic components become increasingly stringent, IOTA 69102 Addition-curing One-component Thermal Conductive Adhesive stands out with its outstanding performance.
This material supports two processes of stencil printing and dispensing, adapting to diverse production scenarios. It features low BLT and excellent bonding performance. It can cure rapidly after heating at 150℃ for 30 minutes, helping to improve production efficiency. With a thermal conductivity of 0.6 W/m·K, low thermal resistance change rate and good flexibility, it effectively ensures heat dissipation stability. Its shear strength (Al/Al) can reach 1.5 MPa after curing.
Whether it is the bonding of plastic shells and aluminum plates of automotive electronic devices, the thermal conductive bonding and fixing of heating components or MOS tubes, the lamination of heating elements, the fixing and bonding of wafers, or the bonding and sealing of casings, IOTA 69102 can handle them with ease and serve as a capable assistant in industrial production.