The stable operation of electronic devices relies on the dual guarantee of efficient thermal conductivity and firm bonding. IOTA 69445, a one-component addition-curing thermal conductive adhesive material, integrates multiple advantages to easily meet industry challenges!
In a gray microfluid state, it is compatible with stencil printing and dispensing processes, and its low BLT feature makes construction more convenient. With a high thermal conductivity of 2.5 W/m·K and a low thermal resistance change rate, it conducts heat quickly and efficiently, preventing components from being damaged due to overheating. It cures rapidly in 30 minutes at 150°C, and after curing, it possesses a hardness of 75±5 Shore A and a shear strength of 2.2 MPa. The bond is firm yet flexible, adapting to complex application scenarios.
Whether for bonding plastic casings and aluminum plates in automotive electronics, fixing MOSFETs and heating elements, or bonding wafers and sealing enclosures, it covers all scenarios seamlessly. With a scientific density of 3.0 g/cm³ that balances performance and practicality, it provides a stable and reliable thermal conductive bonding solution for electronic manufacturing, winning wide favor among manufacturers!