The stable operation of electronic devices is inseparable from high-quality thermal conductive adhesive materials. IOTA 69550, a one-component addition-curing product, addresses industry pain points with its robust performance and has become the trusted choice of numerous manufacturers.
In a semi-thixotropic fluid state, it is compatible with stencil printing and dispensing processes, enabling flexible and efficient construction. Boasting a thermal conductivity of 2.2 W/m·K and a low thermal resistance change rate, it efficiently dissipates heat, preventing equipment malfunctions caused by overheating. It cures rapidly in 30 minutes at 150°C, and after curing, achieves a hardness of 75±10 Shore A and a shear strength of 3.2 MPa. The bond is firm yet flexible, resistant to detachment and cracking.
Whether for bonding plastic casings and aluminum plates in automotive electronics, fixing MOSFETs, heating elements, or wafers, or sealing enclosures, it performs impeccably. With a scientifically formulated density of 2.65 g/cm³, it balances performance and practicality, providing reliable support for electronic manufacturing!