Featuring a two-component formulation, this material forms a tough adhesive layer after curing, boasting excellent thermal conductivity and bonding strength. It enables efficient heat transfer and firm component adhesion, effectively resolving equipment heat dissipation issues and loosening risks. With a mild curing process and low shrinkage rate, it is compatible with various substrates. Whether for precision bonding of electronic components or heat-dissipating assembly of new energy equipment, it precisely meets application requirements.
In industrial production, it offers easy operation and compatibility with batch processing, significantly boosting production efficiency. Under harsh working conditions, it resists temperature fluctuations and environmental corrosion, ensuring long-term stable operation of equipment. From electronics and electrical appliances to the new energy sector, IOTA-68210 empowers devices with reliable performance, serving as a powerful ally for enterprises to enhance product qualit