In the precision manufacturing of electronics, electrical appliances, new energy and other industries, the dual requirements for thermal conductivity and bonding are becoming increasingly stringent. IOTA-69102 addition-cure one-component thermally conductive adhesive emerges as the optimal solution to address industry pain points.
Formulated with advanced addition-cure technology, this one-component adhesive requires no mixing, enabling convenient and efficient application that significantly boosts production efficiency. Once cured, it forms a tough bonding layer that not only ensures firm fixation of components but also delivers excellent thermal conductivity. It rapidly dissipates heat generated during equipment operation, effectively reducing temperature rise and extending product service life.
Boasting superior resistance to high and low temperatures as well as aging, it maintains stable performance even under complex working conditions, making it suitable for diverse scenarios such as electronic component encapsulation and new energy module bonding. Environmentally friendly and odorless, it complies with modern industrial environmental standards, providing reliable support for high-end manufacturing. Whether for the assembly of precision electronic devices or the thermally conductive bonding of new energy equipment, IOTA-69102 precisely meets application needs and helps enterprises enhance product quality and core competitiveness.