In fields such as automotive electronics and cell encapsulation, stable heat dissipation and firm bonding are key to the long-term operation of components. IOTA 69322 condensation-type two-component thermally conductive adhesive material meets scenario needs with precise characteristics!
As a silicone thermally conductive adhesive, it combines ease of use and reliable performance: the 1:1 mixing ratio enables convenient operation, no complex proportioning tools are required, and it is easy to use; its paste state is suitable for various construction scenarios such as gap filling and bonding, adapting to different component structures. At the same time, the thermal conductivity of 0.9 W/(m·K) ensures efficient heat transfer, good thermal stability prevents performance impacts from temperature fluctuations, and the hardness of 70±5 Shore A provides stable support for bonded parts.
Whether it is for the heat dissipation and bonding of automotive regulators or the thermal conduction and sealing of cell gap filling, IOTA 69322 can accurately meet the needs, build a dual defense line of heat dissipation and bonding for components, and help equipment operate stably!