In the manufacturing of automotive electronics and precision components, challenges such as the difficulty in balancing thermal conductivity and bonding strength, and low curing efficiency often hinder production. However, IOTA 69445 addition-type one-component thermal conductive bonding material provides an excellent solution to these pain points.
It is compatible with both stencil printing and dispensing processes, enabling flexible and convenient operation. Featuring low BLT, it is suitable for precision scenarios. With a thermal conductivity of 2.5 W/m·K and a low thermal resistance change rate, it can efficiently conduct heat from components. After rapid curing at 150°C for 30 minutes, it not only achieves a hardness of 75±5 Shore A and an Al/Al shear strength of 2.2 MPa but also retains flexibility, meeting both stable bonding and deformation resistance requirements.
This gray microfluidic material with a density of 3.0 g/cm³ is competent for various applications, including the tight bonding of plastic casings and aluminum plates in automotive electronics, thermal conductive bonding and fixing of heat-generating components like MOS tubes, bonding of heating elements, fixing and bonding of wafers, and bonding and sealing of casings. It builds a solid protective line for the stable operation of electronic components.